Based on a 10 µm pixel design and incorporating a resolution of 1280 x 1024 pixels, the sensor offers high sensitivity and an on-chip gated global shutter mode that enables gating times down to 42 ns. The unit allows adaptability to various scenarios, with precise 3D information detection and 1.3 MP depth resolution; scene capture with a large field-of-view in both 2D and 3D, which enables cost effectiveness and system optimization useful for static applications such as construction or architectural mapping; real-time 3D image capture with a depth map of over 30 fps in a four-phase operation; and reliability in challenging conditions. Short- and long-range capabilities are immune to ambient light intrusions, using a unique HDR feature. The sensor comes with an evaluation kit comprised of a compact 1-inch optical format calibrated module that includes a light source for near infrared illumination. It also includes optics targeted at performing the time-of-flight principle at short-range distances to 5 m or mid-range distances to 10 m, while capturing real-time 3D information at a full resolution of 1.3 MP.
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Teledyne e2v
https://www.teledyne-e2v.com/
845.425.2000
