作为发展时间敏感网络（TSN）标准progresses and more suppliers become involved, organizational alliances are developing to more quickly advance work on the standard. A case in point is the announcement of an agreement between theIndustrial Internet Consortium (IIC)和Avnu Alliance.
The two organizations have agreed to work together to advance deployment and interoperability of devices with TSN open standards. According to IIC and Avnu, the organizations will “align efforts to maximize interoperability, portability, security and privacy for the industrial Internet.” TheIIC supports two TSN testbedswhere member companies collaborate to test TSN implementations and device interoperability.
Joint activities between the IIC and Avnu Alliance will include:
- Identifying and sharing Industrial Internet of Things (IIoT) best practices;
- Realizing interoperability by harmonizing architecture and other elements; and
- Collaborating on standardization.
Todd Walter, Avnu Alliance Industrial Segment Chair and chief marketing manager at National Instruments, said Avnu’s liaison agreement and work with the IIC TSN Testbed demonstrates “real-world applications and solutions with TSN and helps to accelerate readiness for the market. The testbed stands as a showcase for the value that TSN standards and ecosystem of manufacturing applications and products bring to the market, including the ability for IIoT to incorporate high-performance and latency-sensitive applications.”
AVNU和IIC于10月与20家公司开设了TSN Testbend Plugfest，以评估和进行TSN设备符合测试，以开发为工业市场开发基线认证。这项活动是过去18个月在美国和欧洲进行的八个动手插件中的最新活动。从这些插件中学到的经验教训和正在进行的IIC TSN测试床活动有助于TSN标准的一致性测试开发，并根据需要将其纳入标准修订。根据AVNU的说法，这些符合性测试可确保设备或其嵌入式硅符合相关的IEEE标准，以及AVNU根据适当的系统互操作性选择的其他要求。
在2017年10月的Plugfest之后，AVNU Alliance和IIC宣布了与OPC Foundationto provide conformance testing and certification of OPC UA over TSN devices. The OPC Foundation also announced the availability of the “release-candidate form” of the Publish-Subscribe extension for OPC UA. Thomas Burke, OPC Foundation president, said this extension “enables the exchange of OPC UA over UDP connections” and notes that it is “the prerequisite for running OPC UA over TSN. OPC UA over TSN adds additional capability to the OPC Foundation portfolio, including enhancing controller-to-controller and machine-to-machine communication and information integration.”
Companies currently participating in the IIC TSN Testbed are: Analog Devices, Avnu Alliance, Belden/Hirschmann, Bosch Rexroth, B&R Industrial Automation, Calnex, Cisco, Hilscher, Intel, ISW, Ixia, Kalycito, KUKA, National Instruments, Phoenix Contact, Pilz，Renesas Electronics，Sick AG，Tttech，Wago和Xilinx。
This video highlights the October 2017 plugfest at the IIC testbed hosted by National Instruments at its Industrial IoT Test Lab in Austin, TX.
