odva（www.odva.org), the association that oversees network technologies based on the共同的工业协议(CIP), announced recently that it has published new editions of the specifications for ODVA networks, enhancing theEtherNet/IP,DeviceNet,CompoNetandControlNettechnologies. (ODVA was formerly known as the Open DeviceNet Vendors Association.)
ODVA’s biannual updates of these network specifications are designed to allow end-users to meet an ever-increasing scope of industrial automation applications. Coupled with the updates to the specifications published in November 2009, there have been 46 enhancements made over the past six months. Among these enhancements, the ODVA identified the following as especially noteworthy:
•对于以太网/IP，对设备级别环（DLR）协议进行了改进，以使用户更容易在环中找到故障，并知道其DLR节点支持哪些功能。
• In process control, newer pressure gauges can handle wider pressure ranges with much improved resolutions at both the high and low end. Accordingly, the CIP Trip Point Object has been extended to allow users more flexibility in setting the appropriate trip point(s) for their applications.
• Numerous improvements have been made to the Electronic Data Sheet (EDS) definitions, allowing the EDS file to be a more accurate representation of devices to the software tools.
• The ability to integrateModbus进入CIP体系结构的设备继续得到改进，最著名的是，通过在规范中包含CIP-Modbus Translator设备配置文件，以及通过Modbus对象将Modbus对象的细化和迁移到CIP卷中。这种改进使得具有大量Modbus数据结构的以前的Modbus/TCP（或Modbus）设备的供应商更容易将其设备直接放在CIP网络上。它允许供应商通过适当的CIP应用程序对象使设备的主要数据可用，同时仍可以在设备Modbus数据结构中提供CIP访问。
• Due to the ongoing availability of new field programmable gate arrays (FPGAs) and Network Processing Engines (NPEs) for the ControlNet Data Link Layer, diagnostic enhancements were made to make it easier for users to identify which implementation was provided in each of their nodes.
The specifications are organized as a group of publications entitled The CIP Networks Library. Each specification is made up of one or more volumes of The CIP Networks Library.
ODVA expects that devices containing new enhancements found in the latest specifications will be available in 2010. Specifications are available on a subscription basis, subject to a Terms of Usage Agreement. For more information on how to obtain a copy of any of the specifications, visit ODVA’s Web site atwww.odva.org.
ODVA
www.odva.org
