At this year’s PACK EXPO International show, from November 6-9 in Chicago’s McCormick Place, B&R In-dustrial Automation Corp. will exhibit automation technologies that are trending in packaging machinery de-sign at booth N-6141. B&R specializes in standards-based, scalable and modular control systems integrat-ing CNC, logic, general motion, open and mapp robotics, human-machine interface (HMI), safety, I/O and data acquisition in a unified software development environment.
支持关键包装趋势的自动化创新
Consumer packaged goods (CPG) makers face many operational challenges identified by PMMI’s OpX Leadership Network, whose Total Cost of Ownership workgroup is sponsored by B&R. B&R’s automation platform provides solutions that differentiate packaging machinery builders in the marketplace.
These solutions help
• Overcome the persistent skills gap by simplifying machinery development, operation and mainte-nance through expanded mapp (modular application) Technology functionalities.
•通过网络安全（包括安全的运动和安全机器人技术）实现新的正常运行时间和OEE级别，以减速包装线，而不是停止它们。
•通过与SuperTrak®线性工业运输技术同步开放机器人技术，提高产品和包装运输，增值处理以及机器对机器的集成的效率。
• Support CPGs’ corporate Internet of Things strategies through standards such as OPC UA and best practices being identified by the Industrial Internet Consortium (IIC). B&R co-chairs the IIC’s new Smart Factory Task Group.
• Enable the need to accommodate short product life cycles and shorter runs with more frequent changeovers through automation that replaces manual changeover procedures and tools with reci-pe-driven, pushbutton automated changeovers.
•通过提供开放的，启用Web的控件和HMI平台，以支持主流技术，例如增强现实和安全的远程访问，以配备B＆R的未来证明机械。
Student robotics competition
Exclusively sponsored by B&R, PMMI will host teams from the 2016 FIRST Robotics competition at the “Fu-ture Innovators — Robotics Showcase” in booth N-4585.
The teams of high school students will display and demonstrate the robots they entered in this year’s “FIRST Robotics national robotics competition. FIRST Robotics inspires youth to leadership in science and technolo-gy by engaging them in exciting, mentor-based programs that foster science, engineering and technology skills, as well as critical life skills including self-confidence, communication and leadership.
B&R will demonstrate the state of the art in open robotics with a B&R controlled Comau robotic cell, inspiring the student competitors to fulfill their future career ambitions in robotics in packaging applications.
演出的每一天都会看到两支球队在半天的轮班中展示他们的机器人，以“友好竞争”的一小时重叠。PMMI的教育与培训基金会将向每所高中捐款500美元，以支持团队。
The Future Innovators project seeks to promote high school engineering programs to attendees and exhibi-tors, encouraging them to support their local schools in developing future innovators, and to encourage young innovators while introducing them to PACK EXPO and packaging/processing as a career choice.
Student-employer networking event
All registered PACK EXPO International/Pharma EXPO exhibitors and attendees are welcome and invited to join the PMMI NextGEN Networking Fair, exclusively sponsored by B&R, on Sunday, November 6, from 3–5 p.m. in the Education & Workforce Development Pavilion, on the mezzanine level.
The event is for CPGs looking for skilled workers and machine builders needing to fill the void when baby boomers finally retire. In its first year, this B&R sponsored networking event will provide students an oppor-tunity to meet and interact with PMMI members, as well as PACK EXPO exhibitors and attendees. Light refreshments will be served.
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