霍尼韦尔宣布推出一年一度的UniSim Design Challenge, a series of process design competitions which recognize young talent from across three regions: Americas, Asia-Pacific, and EMEA (Europe, the Middle East and Africa).
每个区域竞争将奖励创新concepts that use Honeywell's UniSim Design process simulation software, which is freely available to anyone teaching at a university or college. Students are tasked with creating a new design or model showcasing a process problem and their UniSim Design-based solution. The top entries from each competition will win a trip to their regional Honeywell Users Group (HUG) event, taking place in the United States for HUG Americas, Australia for HUG Asia Pacific, and The Netherlands for HUG Europe, Middle East and Africa, later this year.
The HUG events give students a unique insight into the process industries, as well as the opportunity to network and present their projects to attendees and potential employers. Sponsoring tutors also receive the opportunity to attend the event, as well as a training course at one of Honeywell's world-class automation colleges. The prize covers travel, accommodation and registration costs for the event.
Vimal Kapur, vice president and general manager for Honeywell Process Solutions, said: "Each year we look forward to offering a global arena for students to debut their talents to a variety of process companies, and are always exceptionally impressed by the caliber of candidates who take part. With a need for talent across all parts of the industry, Honeywell aims to provide a platform to nurture and inspire students about the opportunities in the science, technology and engineering disciplines. The UniSim Design Challenge is an excellent opportunity for students to develop their skills and learn more about the industry."
Many previous winners of the competition have subsequently been hired by Honeywell, ZADCO, Virthualis and other process control companies.
Competition details
All entries must use Honeywell UniSim Design Suite software, available free to professors teaching at students' universities and colleges.
Final entries must be submitted by 25 April for the Americas, 27 June for Asia Pacific and 30 September for EMEA.
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