GE的科学家Global Research Center (www.ge.com/research)在纽约州的Niskayuna，已经展示了一个先进的热材料系统，该系统可以为更快的计算和更高的性能电子系统铺平道路。根据GE的纳米技术高级技术计划开发的利用技术，他们制作了一种原型底物，可以两次和铜两次冷却电子设备，例如笔记本电脑。
“随着电子设备变得更加先进，我们正在接近像铜这样的传统材料无法吸收热量的地步。为了使计算更快，电子系统要变得更有能力，更好的冷却解决方案，例如GE的原型底物，才能实现这一目标。
自电子年龄的黎明以来，铜一直是冷却电子产品的首选材料，因为其具有良好的热传导性能。但是，随着电子系统变得越来越高，它们会产生越来越多的热量。过多的热量会限制这些系统的整体性能，从而影响计算速度和处理能力。将需要新的突破性材料来启用更高级的系统和应用。
The development of GE’s prototype substrate, which utilizes phase-change-based heat transfer, is part of a four-year, $6 million program funded by the Defense Advanced Research Program Agency (DARPA, Contract # No. N66001-08-C-2008). As the leading organization of the program, GE Global Research has been collaborating with GE Intelligent Platforms, the Air Force Research Laboratory, and University of Cincinnati on the project.
Dr. Tao Deng, a senior scientist at GE Global Research and the project leader, said, “As electronics become more advanced, we are approaching the point where conventional materials like copper can’t take the heat. For computing to go faster and electronics systems to become more capable, better cooling solutions such as GE’s prototype substrate will be required to allow this to happen.”
Deng added, “In demonstrations, GE’s prototype substrate has functioned effectively in a variety of electronics application environments. We also subjected it to harsh conditions during testing and found it could successfully operate in extremely high gravity applications.”
Deng指出，GE的原型在正常力强力的10倍以上的条件下运行。相比之下，这种重力力是世界上最快的滚筒旋风架上最大力量的两倍以上。
GE’s phase-change based prototype substrate can be applied to computer chips and a variety of different electronic components. It acts as a cooling mechanism that spreads or dissipates the heat generated in electronic systems to keep components cool
在空军研究实验室进行测试期间，GE的研究团队成功证明了原型底物，该原型底物被测量至少是其重量仅为其重量的四分之一的导热率的两倍。
具有高导热率，低重量和高“ G”加速度性能，该基材可以在各种不同的系统中很好地运行，从笔记本电脑到更大的规模，更复杂的计算系统，这些系统运行航空电子系统和电子控制系统在机板喷射机上和其他飞机。
与美国政府的各个机构合作，GE Global Research一直在开发几种先进的热力技术。除了DARPA的努力外，邓博士还领导一支由空军研究实验室支持的团队，以开发高速飞行的高级热解决方案。这些努力将建立一个全面的热解决方案平台，以服务于包括GE Aviation，GE Energy和GE智能平台在内的多个GE业务。
Global Research Center (www.ge.com/research)
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